A comprehensive review electronic cooling: A nanomaterial perspective

Abstract

In the 21st-century era of electronics and the digital world, electronic gadgets are handy worldwide, and routine life without utilizing these gadgets is difficult. Compact size and lightweight are the most predominant factors in the development of chronic devices. Compacting the size of the electronic device faces the biggest challenges of heat transfer caused though maximum collapse. A study area that combines the advantages of nanofluids with mini channels has emerged as one of the most intriguing options as the heat generated by new electronic components keeps increasing. In this review paper, paramount information in the form of a summary of on-going research and completed research work of alternate methods are included. This article reviews current studies on the application of nanofluids for cooling electronics. This article also presents several fascinating aspects on the utilization of nanofluids and methods to be used for cooling electrical components. Additionally, this article provides and discusses the potential directions for future study and the current issues in this field. In the not-too-distant future, it has been shown that using nanofluids as innovative cooling medium said as novel coolants and heat pipes can considerably improve the cooling technology for electronic equipment. The traditional cooling methods are not efficient for thermal management, so the new devices developed through carbon nanotubes (CNT) with high thermal conductive nanoparticles, nanofluids, and hybrid materials enhance heat transfer through electronic devices. The advancement of such technology may provide viable outcomes by reducing the dimensions of electronic gadgets and depicting an improvement in their efficiency.