Abstract
To cater to the application in various micro/nano devices, this paper reports a compatible and efficient approach combining electrodeposition and dealloying to fabricate bi-continuous nanoporous copper films. In the electrodeposition step, effect of concentration ratio of different ions, pH of the solution and cathode current density on the elementary composition and microscopic morphology of the deposited alloy are systematically investigated, obtaining an optimum condition with good stability and process compatibility. A uniform copper-zinc alloy with its zinc content improved to ~67 at.% is prepared under this condition. A uniform nanoporous copper with an average pore size of 150 nm is fabricated by ultrasonic assisted dealloying whose efficiency is significantly improved compared to free dealloying. This method is promising to be used in the mass production of nanoporous copper films, benefiting researches on various practical applications in micro/nano devices.
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