Abstract
A JSME project is in progress to implement a methodology called the Build-up Approach (BUA). The BUA is designed to expedite thermal design of electronic equipment. Following the description of BUA concept presented earlier at the 02 JSME Annual Meeting, this presentation focuses on one of the key steps involved in the knowledge development phase. Components placement in the system box is represented by two groups of numeral strings. The string groups correspond to the modes of components shuffling on the printed card board or in the system box, tile shuffling and vector shuffling. Strings manipulation enables organised search for a components placement pattern that renders higher thermal performance.
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