Abstract
A semiconductor package having a gull-wing, zig-zag, inline-lead configuration and end-of-package anchoring devices for rigidly af fixing the package to a circuit board such that each lead is in compressive contact with its associated mounting pad on the board. The anchoring devices of a first embodiment comprise anchoring pins (12) having fish-hook-type barbs (20) which lock against the under side of the board (13) when the pins are inserted through holes (15) in the board; a second embodiment utilizes anchoring pins (54) which are adhesively bonded in recesses (52) that have been drilled or molded into the board (52); a third embodiment utilizes anchoring pins (62), the ends of which can be bonded directly to planar peg-bonding regions on the surface of the board (63); and a fourth utilizes tapered anchoring pin (74) which may be inserted with an interference fit into holes (75) in the board. The invention eliminates the need for mechanical support of the packages during solder reflow operations used during board assembly and repair.
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