Abstract

In this paper, a new possibility of fabricating a metal lattice structure with a continuous rod is demonstrated. A multi-layer, periodic, and aperiodic lattice structure can be manufactured with a continuous thin rod by bending it with a repetitive pattern. However, joining their nodes are challenging and an important problem to solve. This paper is investigating the joining of nodes in a loose lattice structure by delivering materials through the dipping process. Both liquid state (epoxy) and solid-state (inorganic particles) joining agents are considered for polymer–metal and metal–metal bonding, respectively. Liquid Carrier Systems (LCS) are designed considering their rheological behavior. We found 40% solid loading with the liquid carrier system provides sufficient solid particles transfer at dipping and join the lattice node using transient liquid phase bonding (TLP). 3D metal lattice structures are constructed, and their mechanical properties are investigated. The lattice structure shows comparable strength even with smaller relative density (< 10%). The strength and elastic modulus of all the fabricated samples decreases with the increase in cell size, which is consistent with the traditional wisdom.

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