Abstract
This paper demonstrates package-integrated power dividers with footprint smaller than the free-space wavelength corresponding to the operating frequency of 28 GHz band for 5G Antenna-in-Package (AiP), by utilizing precision low-loss redistribution layers (RDL) on glass substrates for highly-integrated mixed-signal systems. Two configurations of power dividers with two-way and three-way equal power split are modeled, designed and fabricated on glass substrates with thin-film build-up layers. This approach combines the benefits of ceramic and low-loss polymers for electrical performance, and silicon-like dimensional stability of glass for precision panel-scale patterning. Multilayered RDL with sub-20 micron features are utilized to design innovative power divider topologies with benefits in terms of low added insertion loss (<0.8-dB) and minimal phase-shift between the output ports, due to high precision of distributed transmission lines and through panel vias (TPVs). These power dividing networks depict upto 25% lower added insertion loss as compared to similar structures on fine pitch InFO RDL. The power dividers are also configured as 2×1 and 3×1 antenna arrays using Yagi-Uda antennas which cover the entire 28 GHz 5G band. The performance of power dividers as well as corresponding antenna arrays shows an excellent correlation between simulated and measured results.
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