Abstract
In this paper, our effort in strain‐engineered platform technology for stretchable hybrid electronics (SHE) is reviewed, which includes mold‐based substrate thickness modulation, printed‐rigid‐island embedding, printed pure‐epoxy banks patterning, and liquid‐metal floating chip‐bonding structure. The platforms using those strategies excellently suppressed highly localized stress at transition area between rigid and soft components and thus protected elements (surface mount chips, light emitting diodes, sensors, etc.) from breakage under tensile strain conditions. Although each structure has its own pros and cons, electronic systems with such structure stably operate for tensile strain up to 10s percent.
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