Abstract
In this paper, our effort in strain‐engineered platform technology for stretchable hybrid electronics (SHE) is reviewed, which includes mold‐based substrate thickness modulation, printed‐rigid‐island embedding, printed pure‐epoxy banks patterning, and liquid‐metal floating chip‐bonding structure. The platforms using those strategies excellently suppressed highly localized stress at transition area between rigid and soft components and thus protected elements (surface mount chips, light emitting diodes, sensors, etc.) from breakage under tensile strain conditions. Although each structure has its own pros and cons, electronic systems with such structure stably operate for tensile strain up to 10s percent.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.