Abstract
AbstractOrion Electric Co. has developed an XGA resolution, 165 μm pitch 25″ Plasma Display Back Panel by combining the process and cost benefits of the LTCC‐M (Low Temperature Co‐fired Ceramic on Metal) substrate technology with a high‐resolution one‐step “Barrier Embossing” technique. Tensile tests on green sheets were conducted and the effects of green sheet mechanical properties on embossed barrier height were investigated. LTCCM back panels (8″) were sealed to sodalime glass front panels and the assembled parts were successfully evacuated to 10−7 torr without cracks on the glass side.
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