Abstract

This paper first surveys 2.5D methodologies, which are based on modal decomposition principle, for efficient modeling of electronic packages and multilayer printed circuit boards (PCB). It then reports the latest development of 2D discontinuous Galerkin method (2D DGTD) based 2.5D methodology for analysis of signal and power integrity in multilayer PCBs. Moreover, the recent study of handling narrow slots in the power-ground planes by a hybrid 1D- and 2D-DGTD method is also presented. Numerical examples are given with simulation results compared against measurement as well as full-wave simulation results.

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