Abstract
As the technology is going below 7 nm or still lower, pCMP (Post-CMP) cleaning is becoming a more critical step to reduce the defects generated from CMP process. PVA brush scrubbing is a vital technique used for pCMP cleaning to remove slurry particles and other polishing residues remained after CMP. Very recently PVA brush has become the most critical consumable to reduce the defect levels, as the brush itself has been found to be a source of several defects. Hence, it has become important to understand every aspect of PVA brush. In this chapter, a systematic explanation of PVA brush is provided starting with its preparation, design, kinematics and tribological effects. A special type of defects that might be generated from PVA brushes is summarized. A detailed explanation about the defect generation possibilities from PVA brushes and their analysis are provided. New techniques to reduce the defects are also discussed.
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