Abstract
We have developed a 160 times 120 SOI (silicon on insulator) diode uncooled IRFPA (Infrared Focal Plane Array) with 25 mum pixel pitch for a small IR camera. The IRFPA has a highly responsive pixel structure and is packaged in a chip scale vacuum package (CSVP) in order to reduce the package size. The size of the package is 14.5(L) times 13.5(W) times 1.2(H) mm. An infrared image of less than 60 mK in NETD (Noise Equivalent Temperature Difference) with f/1.0 optics has been obtained by the developed IRFPA.
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