Abstract
The laminated structures, the use of multiple materials, including polymeric materials and the large temperature excursion, render the microelectronic assemblies susceptible to damage caused by temperature and moisture. The increasing use of microelectronic assemblies in portable electronic products introduces a relatively new driving force for damage: drop impact. This chapter introduces microelectronic assemblies, including the advanced integrated circuit packaging, and presents an overview of the three damage driving forces: temperature, moisture and drop impact.
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