Abstract
Strong production demand for 0.33NA EUV Lithography has enabled investments in further tool development, resulting in a steady roadmap of 0.33NA tools with improved imaging, overlay, defectivity and productivity, as well as a robust ecosystem supporting use of these tools in HVM. In parallel, co-investments by end users in development and initial production of 0.55NA tools has kept this technology on track for production in 2025, only six years after 0.33NA tools entered production. Continued innovation in semiconductor device structures and processes is on track to support use of the designed resolution and EPE of the 0.55NA tools to continue scaling.
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