Abstract
The effects of the thickness of Cu underlayer and Sm-Co layer in Sm-Co/Cu film were studied. When the thickness of Cu underlayer was 200 nm, its preferred orientation was (111), and the grain size was as large as 300 nm, owing to the substrate heating during the Sm-Co layer deposition. When the Sm-Co layer thickness was as thin as 10 nm, an SmCo5 (002) diffraction line was observed in the XRD diagram, and the perpendicular coercivity was about 6.2 kOe. The magnetic properties of the Sm-Co/Cu film did not show any visible changes for 450 days. It was found from XPS depth profiles that Cu element was diffused into the Sm-Co layer from the underlayer, and may be effective in preventing Sm from oxidizing.
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