Abstract
In semiconductor manufacturing, small and precise tools such as collets are used during the assembly process to control and improve product quality. Monitoring the quality of the collet, such as its shape, size, and hole, is crucial for ensuring high reliability when picking up a cut wafer during the semiconductor packaging process. In this study, we propose a defect detection algorithm using image processing techniques. The application was implemented in a visual C++ environment, which enables motion control, image acquisition control, and the execution of image processing algorithms. The test and analysis of the collet inspection system yielded a defect detection rate of 99.3%.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: Journal of the Korean Society of Manufacturing Technology Engineers
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.