マルチ・ワイヤソー切断におけるワイヤ走行速度およびインゴット送り速度の効果 φ４００ｍｍシリコンインゴットの切断に関する研究 （第２報）

Abstract

This paper presents the effects of a wire running speed and a work feed rate on the multiwire saw slicing of 400mm-diameter silicon ingots from the viewpoint of the cutting force and the slurry layer thickness adhering onto the running wire. The cutting force, which becomes a cause of warp and waviness, is proportional to a work feed rate and inversely proportional to a wire running speed. The change of slurry layer thickness, which makes the global wafer thickness variation (GBIR), is derived from Navier-Stokes equation, and becomes more uniform along a cutting chord length at a higher wire running speed. By increasing the wire running speed from 500m/min to 850m/min (on an average) and optimizing the work feed rate, the GBIR and warp of the sliced wafers are reduced to half of the conventional products.