Abstract
A one-component organosilicon composition based on a solution of the Lestosil SM-NT block copolymer containing an optimal ratio of linear polydimethylsiloxane and ladder phenylsilsesquioxane units in an organic solvent has been developed. As a curing system, a solution of heterosiloxane containing boron and zirconium atoms in the siloxane chain in alkoxysilane and special additives that improve the performance properties of coatings were used. The composition is intended for production of heat-resistant electrically insulating and moisture-resistant coatings with enhanced physical-chemical properties, used as protective materials in microelectronics and electronic products.
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